Ever increasing demand for short lead-time and high component-density challenges current pallet-supply approaches:

  • PCB-based pallet-design starts after receiving an assembled PCB, which is highly wasteful lead-time-wise.
  • PCB-less pallet-design (e.g. using tallest-SMT) compromise pallet performance, thus precluding wave-soldering of high-density PCBs.

Suron's AutoPallet software permits for both PCB-less and high-end pallet-design:

  • Pallet design may start as soon as PCB-design ends
  • Pallet design handles THP-SMT distances below 0.05 inch

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